Join us for an onsite tour on March 7 to experience Qualcomm‘s Surface Mount Technology (SMT), Final Assembly and Test (FAT) and Micro-electronics Assembly (for RFFE) areas. Learn how our chipsets and technologies are applied to product developments on platforms like Modem Test Platforms (MTP), Core Development Platforms (CDP), Test Base Stations (TBS) and a host of other products and devices that enable further engineering developments. You will observe state of the art equipment and machinery in action as we facilitate Time To Market for Qualcomm products.
The factory visit is offered upon request as part of your ticket booking. If you haven’t already booked, get in touch today to secure one of the 24 places available.